Cluster Systems
Cluster Systems
FZ Juelich Cluster
4“ multi-module cluster tool installed at the HNF (Helmholtz Nanofabrication Facility) in the FZ Juelich (Forschungszentrum Jülich, Germany). It consists of several MBE (Metal, III-V) and UHV sputter deposition chambers interconnected by a combination of linear transfer lines and central distribution chambers equipped with a telescopic transfer arm. Vacuum connection is also realized to an ALD deposition tool (FlexAL) via a buffer/sample-flip chamber.
IQC Cluster Tool
The Institute for Quantum Computing at the University of Waterloo owns a large cluster system from Omicron with 5 deposition modules plus a nicely equipped analytical module and a preparation chamber. The motorized cable-driven linear transfer line allows fast and reliable wafer handling (2″) under true UHV conditions. The chambers are designed for: Oxide MBE, Metal MBE, Topological Insulator MBE, Superconducting Material Sputtering, Magnetic Material Sputtering, Surface Analysis.
EIT+ Cluster Tool
The Wroclaw Research Centre EIT+ has recently received a dual-chamber MBE (III-Nitride-MBE) for 4″ wafers from Scienta Omicron. The cluster has successfully been installed in the devsion NanoMAT, the application of nanotechnology in advanced materials. Besides the two MBE reactors the cluster includes a combined MXPS / SPM analysis module also featuring 4″ wafer holders. The so called Large Sample AFM (SPM) allows beam deflection AFM (MFM, EFM) as well as STM, both with ultimate atomic resolution capability.
The scope of the NanoMat project encompasses interdisciplinary research activities focused on manufacturing advanced materials as well as on developing nanotechnologies in fields such as nanoelectronics, optoelectronics, microsystems, molecular electronics, photonics, non-linear optics and nanomagnetism. The aim of the proposed research is to acquire knowledge of how to obtain materials with new or improved properties, to determine their potential practical applications as well as develop selected technologies of their manufacture.
UTD Cluster Tool
Reactions at interfaces, thin film electronic properties, the role of defects and impurities, and thin film morphology are all important aspects in the fabrication process and ultimately influence the resultant electrical properties.
A thorough understanding of these issues requires the control of the ambient that can only be provided by a UHV environment.
To study these issues, a unique multi-module cluster tool is now installed at University
of Texas at Dallas for research on the fabrication and characterization of electronic materials. Professor Wallace worked with the team to design the system specifi cally for these studies, while providing fl exibility for future research in other areas of electronic
materials research.
Instrument Concept
The system is capable of thin film deposition using PVD methods including electron beam evaporation, molecular beam deposition, sputter deposition and thermal evaporation methods. Additionally, in-situ characterisation techniques include angle-resolved
monochromatic X-ray and ultraviolet photoelectron spectroscopy, scanning auger electron spectroscopy, atomic force and scanning tunnelling microscopy/spectroscopy.
The system utilises 100 mm diameter wafers (for cleanroom process compatibility), and modified sample plates for the various deposition and characterisation techniques. Wafers are transported throughout the system in a UHV transfer system. Each deposition module has heating and rotational capability for the study of film uniformity and growth kinetics. Moreover, the system is expandable. The design permits the extension of the system to accommodate even more deposition or analytical techniques.
IFW Dresden Cluster
PRO-100 III-V MBE system for high-end quality film growth on 4 inch wafers. The system is equipped with effusion cells for Gallium, Indium, Aluminium, a valved Arsenic cracker source, doping sources, RHEED, beam flux monitor and EPISoft process control software.
Materials Innovation Platform
The “Materials Innovation Platfom” is a new system comprising of three modules: